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A test fixture and deembedding procedure for high-frequency substrate characterization

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dc.contributor Fiez, Terri
dc.contributor Mayaram, Kartikeya
dc.contributor Weisshaar, Andreas
dc.contributor Hackleman, David
dc.date 2005-09-06T20:22:51Z
dc.date 2005-09-06T20:22:51Z
dc.date 2005-06-27
dc.date 2005-06-27
dc.date.accessioned 2013-10-16T07:26:34Z
dc.date.available 2013-10-16T07:26:34Z
dc.date.issued 2013-10-16
dc.identifier http://hdl.handle.net/1957/425
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1957/425
dc.description Graduation date: 2006
dc.description Advisors: Terri Fiez, Karti Mayaram. Committee members: Andreas Weisshaar, David Hackleman.
dc.description At frequencies exceeding 1-2 GHz, the substrate network models used in substrate coupling simulation must account for the reactive nature of the substrate. Unlike at low frequencies, where the purely resistive substrate models can be validated through DC resistance measurements, these high-frequency models, comprising reactive components, must be validated through high-frequency network analyzer measurements. Accurately obtaining such measurements requires careful design of both a measurement test fixture as well as a measurement deembedding procedure. A test fixture has been fabricated and a deembedding procedure designed to enable high-frequency (up to 20 GHz) network parameter measurements of a silicon substrate. A test chip, containing a variety of substrate test structures has been fabricated in a 0.35 μm CMOS process on a heavily-doped substrate. The design of the test fixture, test chip, and deembedding procedure has been validated through extensive simulations in HFSS. Measurements have been made on the test chips mounted in the test fixture. The performance of the test fixture and measurement deembedding procedure has been evaluated, and suggestions for future improvements in this area are presented.
dc.language en_US
dc.subject Substrate coupling
dc.subject Substrate characterization
dc.title A test fixture and deembedding procedure for high-frequency substrate characterization
dc.type Thesis


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