| dc.description |
This thesis presents new, compact configurations for RF/microwave bandstop and lowpass filters for embedded passive applications. A simple design methodology is presented for designing the folded-transmission line filters on a microstrip platform. Unlike the conventional stub-loaded filter designs, the proposed folded-line filters will have practical dimensions for a wide range of electrical specifications, making physical implementation realizable. Further compactness is achieved by folding the transmission lines in a multi-layered environment. A back-to-back microstrip with through-holes in the ground plane is considered for this purpose. Closed-form design equations for the frequency independent R, L, C components have been developed for implementation in the circuit model of the through-ground via. The proposed
configurations offer significant footprint reduction compared to the conventional geometries. Several lowpass and bandstop filters are designed in single and multi-layered environments, and the theoretical response is validated by full-wave EM simulation as well as with measurement. |
|