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Determination of degree of cure of low-temperature phenolic-resin glues by solubility methods

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dc.date 2006-03-29T23:15:32Z
dc.date 2006-03-29T23:15:32Z
dc.date 1943-09
dc.date.accessioned 2013-10-16T07:30:07Z
dc.date.available 2013-10-16T07:30:07Z
dc.date.issued 2013-10-16
dc.identifier http://hdl.handle.net/1957/1488
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1957/1488
dc.description This report is one of a series issued in cooperation with the Army Air Forces and the Bureau of Aeronautics under the supervision of the Aeronautical Board.
dc.language en_US
dc.publisher Madison, Wis. : U.S. Dept. of Agriculture, Forest Service, Forest Products Laboratory
dc.relation Report (Forest Products Laboratory (U.S.))
dc.relation no.1352
dc.title Determination of degree of cure of low-temperature phenolic-resin glues by solubility methods
dc.type Book


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