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Determination of degree of cure of low-temperature phenolic-resin glues by solubility methods

Determination of degree of cure of low-temperature phenolic-resin glues by solubility methods

URI: http://koha.mediu.edu.my:8181/xmlui/handle/1957/1488
Date: 2013-10-16

Description:

This report is one of a series issued in cooperation with the Army Air Forces and the Bureau of Aeronautics under the supervision of the Aeronautical Board.

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