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A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing

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dc.creator Noh, Kyungyoon
dc.creator Saka, Nannaji
dc.creator Chun, Jung-Hoon
dc.date 2003-11-29T20:31:09Z
dc.date 2003-11-29T20:31:09Z
dc.date 2003-01
dc.date.accessioned 2013-10-09T02:32:19Z
dc.date.available 2013-10-09T02:32:19Z
dc.date.issued 2013-10-09
dc.identifier http://hdl.handle.net/1721.1/3746
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron feature size, the characterization of erosion, which affects circuit performance and manufacturing throughput, has been an important issue in Cu CMP. In this paper, the erosion in Cu CMP is divided into two levels. The wafer-level and die-level erosion models were developed based on the material removal rates and the geometry of incoming wafers to the Cu CMP process, including the Cu interconnect area fraction, linewidth and Cu deposition thickness. Experiments were conducted to obtain the selectivity values between the Cu, barrier layer and dielectric, and the values of within-wafer material removal rate ratio, β, for the validation of the new erosion model. It was compared with the existing models and was found to agree better with the experimental data.
dc.description Singapore-MIT Alliance (SMA)
dc.format 688046 bytes
dc.format application/pdf
dc.language en_US
dc.relation Innovation in Manufacturing Systems and Technology (IMST);
dc.subject chemical mechanical polishing
dc.subject erosion
dc.subject semi-conductor manufacturing
dc.title A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing
dc.type Article


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