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Description and characterization of a ECR plasma device developed for thin film deposition

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dc.creator Matta J.A.S. da
dc.creator Galvão R.M.O.
dc.creator Ruchko L.
dc.creator Fantini M.C.A.
dc.creator Kiyohara P.K.
dc.date 2003
dc.date.accessioned 2013-06-01T09:59:28Z
dc.date.available 2013-06-01T09:59:28Z
dc.date.issued 2013-06-01
dc.identifier http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0103-97332003000100011
dc.identifier http://www.doaj.org/doaj?func=openurl&genre=article&issn=01039733&date=2003&volume=33&issue=1&spage=123
dc.identifier.uri http://koha.mediu.edu.my:8181/jspui/handle/123456789/8015
dc.description The design, construction, and characterization of an electron-cyclotron-resonance (ECR) plasma device and its utilization for growing AlN polycrystals are described in detail. The plasma density and electron temperature were measured by two types of Langmuir probes under different conditions of magnetic configuration and RF substrate polarization. For the investigated nitrogen plasmas, the electron temperature increases towards substrate holder and decreases with pressure. The magnetic configuration and plasma parameters required for successful growth of polycrystal aluminum nitride have been determined.
dc.publisher Sociedade Brasileira de Física
dc.source Brazilian Journal of Physics
dc.title Description and characterization of a ECR plasma device developed for thin film deposition


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