Microscale thermal engineering of electronic systems

Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/7305

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DC Field	Value	Language
dc.creator	Goodson, K.E.	-
dc.date	2004-10-28T19:45:39Z	-
dc.date	2004-10-28T19:45:39Z	-
dc.date	2003-05	-
dc.date.accessioned	2013-10-09T02:49:02Z	-
dc.date.available	2013-10-09T02:49:02Z	-
dc.date.issued	2013-10-09	-
dc.identifier	http://hdl.handle.net/1721.1/7305	-
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721	-
dc.description	The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University.	-
dc.format	1587318 bytes	-
dc.format	323957 bytes	-
dc.format	application/pdf	-
dc.format	application/pdf	-
dc.language	en_US	-
dc.title	Microscale thermal engineering of electronic systems	-
dc.type	Presentation	-
dc.type	Technical Report	-
Appears in Collections:	MIT Items

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