TiNi-based thin films for MEMS applications

Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/3844

Full metadata record

DC Field	Value	Language
dc.creator	Fu, Yongqing	-
dc.creator	Du, Hejun	-
dc.creator	Huang, Weimin	-
dc.creator	Zhang, Sam	-
dc.creator	Hu, Min	-
dc.date	2003-12-13T17:59:05Z	-
dc.date	2003-12-13T17:59:05Z	-
dc.date	2004-01	-
dc.date.accessioned	2013-10-09T02:32:47Z	-
dc.date.available	2013-10-09T02:32:47Z	-
dc.date.issued	2013-10-09	-
dc.identifier	http://hdl.handle.net/1721.1/3844	-
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721	-
dc.description	In this paper, some critical issues and problems in the development of TiNi thin films were discussed, including preparation and characterization considerations, residual stress and adhesion, frequency improvement, fatigue and stability, as well as functionally graded or composite thin film design. Different types of MEMS applications were reviewed and the prospects for future advances in fabrication process and device development were discussed.	-
dc.description	Singapore-MIT Alliance (SMA)	-
dc.format	297584 bytes	-
dc.format	application/pdf	-
dc.language	en_US	-
dc.relation	Advanced Materials for Micro- and Nano-Systems (AMMNS);	-
dc.subject	shape-memory	-
dc.subject	TiNi	-
dc.subject	sputtering	-
dc.subject	thin films	-
dc.subject	MEMS	-
dc.subject	microactuator	-
dc.subject	microsensor	-
dc.title	TiNi-based thin films for MEMS applications	-
dc.type	Article	-
Appears in Collections:	MIT Items

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