MEMS Materials and Processes: a research overview

Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/3667

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DC Field	Value	Language
dc.creator	Spearing, S. Mark	-
dc.date	2003-11-10T19:49:43Z	-
dc.date	2003-11-10T19:49:43Z	-
dc.date	2003-01	-
dc.date.accessioned	2013-10-09T02:31:52Z	-
dc.date.available	2013-10-09T02:31:52Z	-
dc.date.issued	2013-10-09	-
dc.identifier	http://hdl.handle.net/1721.1/3667	-
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721	-
dc.description	An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering.	-
dc.description	Singapore-MIT Alliance (SMA)	-
dc.format	1000149 bytes	-
dc.format	application/pdf	-
dc.language	en_US	-
dc.relation	Advanced Materials for Micro- and Nano-Systems (AMMNS);	-
dc.subject	microelectromechanical systems	-
dc.subject	mechanical properties	-
dc.subject	process development	-
dc.subject	process modeling	-
dc.title	MEMS Materials and Processes: a research overview	-
dc.type	Article	-
Appears in Collections:	MIT Items

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