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http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/3667| Title: | MEMS Materials and Processes: a research overview |
| Keywords: | microelectromechanical systems mechanical properties process development process modeling |
| Issue Date: | 9-Oct-2013 |
| Description: | An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering. Singapore-MIT Alliance (SMA) |
| URI: | http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
| Other Identifiers: | http://hdl.handle.net/1721.1/3667 |
| Appears in Collections: | MIT Items |
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