Characterization and Modeling of Stress Evolution During Nickel Silicides Formation

Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/3658

Full metadata record

DC Field	Value	Language
dc.creator	Liew, K.P.	-
dc.creator	Li, Yi	-
dc.creator	Yeadon, Mark	-
dc.creator	Bernstein, R.	-
dc.creator	Thompson, Carl V.	-
dc.date	2003-11-10T19:18:00Z	-
dc.date	2003-11-10T19:18:00Z	-
dc.date	2003-01	-
dc.date.accessioned	2013-10-09T02:31:49Z	-
dc.date.available	2013-10-09T02:31:49Z	-
dc.date.issued	2013-10-09	-
dc.identifier	http://hdl.handle.net/1721.1/3658	-
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721	-
dc.description	An curvature measurement technique was used to characterize the stress evolution during reaction of a Ni film and a silicon substrate to form nickel silicide. Stress changes were measured at each stage of the silicide growth. When the nickel films were subjected to long-time isothermal annealing, stresses that developed during silicide formation gradually relaxed. Fitting the experimental results with a kinetic model provides insight into the volumetric strain and relaxation behavior of the reacting film and the reaction product.	-
dc.description	Singapore-MIT Alliance (SMA)	-
dc.format	379507 bytes	-
dc.format	application/pdf	-
dc.language	en_US	-
dc.relation	Advanced Materials for Micro- and Nano-Systems (AMMNS);	-
dc.subject	nickel silicide	-
dc.subject	stress evolution	-
dc.subject	Coble creep	-
dc.title	Characterization and Modeling of Stress Evolution During Nickel Silicides Formation	-
dc.type	Article	-
Appears in Collections:	MIT Items

Files in This Item:

There are no files associated with this item.

DSpace JSPUI