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http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/3658| Title: | Characterization and Modeling of Stress Evolution During Nickel Silicides Formation |
| Keywords: | nickel silicide stress evolution Coble creep |
| Issue Date: | 9-Oct-2013 |
| Description: | An curvature measurement technique was used to characterize the stress evolution during reaction of a Ni film and a silicon substrate to form nickel silicide. Stress changes were measured at each stage of the silicide growth. When the nickel films were subjected to long-time isothermal annealing, stresses that developed during silicide formation gradually relaxed. Fitting the experimental results with a kinetic model provides insight into the volumetric strain and relaxation behavior of the reacting film and the reaction product. Singapore-MIT Alliance (SMA) |
| URI: | http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
| Other Identifiers: | http://hdl.handle.net/1721.1/3658 |
| Appears in Collections: | MIT Items |
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