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Browsing by Subject electromigration
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Showing results 1 to 6 of 6
Issue Date
Title
Author(s)
9-Oct-2013
Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects
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9-Oct-2013
Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization
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9-Oct-2013
Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments
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9-Oct-2013
Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects
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9-Oct-2013
Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees
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9-Oct-2013
Research Summary: The Effect of Microstructure on the Macroscopic Response of Electroactive Systems
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